Process

The 12 things to lock before a custom Rockchip board project starts

Almost every hardware project that slips does so on a decision that was deferred, not on a technology that failed. This is the checklist we run at kickoff — before the schematic starts, and certainly before the enclosure is tooled.

Bestom engineering note — written by our own design and BSP engineers from work on Rockchip platforms. Platform parameters quoted here are taken from our published datasheets; see Core Boards & SoM. For translated community notes, see the Tech Notes index.

Function

1–4 · What the product does

1. The interface list, frozen

Every external connector, with electrical requirement and connector part number. "We will add USB later" is how a re-spin happens. Include the debug interface — you will need it.

2. The performance budget

Not "fast enough". Numbers: frame rate, resolution, latency ceiling, boot time, sustained throughput. Sustained, not peak.

3. Storage and memory sizing, with headroom stated

DDR density and eMMC size, plus the expected footprint growth over the product's life. State the assumption explicitly so it can be revisited.

4. The model / algorithm owner

If there is AI, name who owns accuracy after quantisation, who owns the calibration dataset, and who accepts the result. Unowned accuracy budgets are the most common cause of AI schedule slips.

Physical

5–8 · What constrains the board

5. Operating and storage temperature range

With the ambient definition written down. Component grade follows from this single line — it is the cheapest constraint to settle and the most expensive to change.

6. The mechanical envelope, including connector access

Board outline, mounting holes, stack-up thickness, and every connector's insertion direction and keep-out. Give the mechanical drawing before layout, not during.

7. The power tree

Input source (adapter, PoE, battery), voltage rails, sequencing requirements, and the worst-case current budget with margin. Battery products also need the charge and gauge decision here.

8. The thermal path

How heat leaves the SoC: heatsink, thermal pad to enclosure, airflow, or none of the above. Decide before the enclosure is tooled — a sealed plastic box with no thermal path derates the platform you chose.

Delivery

9–12 · How it gets to production

9. OS, BSP ownership and update policy

Which OS, who maintains the BSP, how field updates are delivered and rolled back, and how long the BSP will be supported. Decide before the platform, not after.

10. Certification scope and owner

Which markets, which marks, which test house, and who owns the sample submission. Certification lead time sits on the critical path and is frequently discovered late.

11. Production test strategy

What is tested on the line, at which station, with what fixture. A functional test that needs a full boot into the OS does not scale; decide the test points while the schematic is open.

12. Supply horizon and second-source policy

How long the product must stay in production, and which parts need an alternate. Long-life industrial products need this fixed at kickoff, not at last-time-buy.

How to use this list

Take it into the kickoff meeting and mark each item locked, assumed or open. Anything marked assumed should have a named owner and a date. Anything open is a schedule risk you have now made visible instead of discovering in layout.

This is the same list we work through with clients at project start — talk to us if you want to run it against your product spec.

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Related notes

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