Per-Model Spec
M88 · RK3588 · industrial-grade core board
- 8nm · 4×Cortex-A76 + 4×Cortex-A55 @2.6GHz
- NPU 6 TOPS (INT4/8/16/FP16/BF16/TF32) + low-power MCU
- Mali-G610 GPU (450 GFLOPS); WiFi6 (802.11ax)
- BTB connector 320pin; 55×75×8mm
- Applications: smart NVR, cloud terminal, vehicle central control, industrial control, AI edge compute, face-recognition access
M76 · RK3576 · commercial-grade core board
- 4×Cortex-A72 + 4×Cortex-A53, NEON co-processor
- NPU 6 TOPS (dual-core, collaborative / independent); Mali-G52 MC3
- video: decode 8K@30 / 4K@120; encode 4K@60
- New-gen 16MP ISP (HDR/3A/3DNR/dehaze)
- Applications: NVR, cloud terminal, in-vehicle head unit, industrial control, edge AI, face-recognition access
M68 · RK3568 · commercial-grade core board
- 22nm · 4×Cortex-A55 @2.0GHz
- NPU 0.8 TOPS (RKNN, supports Caffe/TF/ONNX/PyTorch)
- DDR 2/4/8GB optional; eMMC 16/32/64/128GB optional
- BTB 240pin (ENIG); 56×50mm; 0~65℃
- Applications: NVR, cloud terminal, vehicle central control, industrial control, edge compute, face-recognition access
M66 · RK3566 · industrial-grade core board
- 22nm · 4×Cortex-A55 @1.8GHz; NPU 1 TOPS
- Stamp-hole 144pin, 1.2mm pitch, 3.3V; 45×45mm minimal footprint
- HDMI2.0 / USB3.0 / MIPI-DSI / MIPI-CSI / PCIe / I2S
- industrial temp range -20~60℃; Android / Linux
- Applications: commercial display, medical device, industrial control, smart POS, robot
B66 · RK3566 · Finished-unit main board SBC
- 4×Cortex-A55 @1.8GHz; NPU 1 TOPS; 12V power supply
- Complete interfaces: POE, LVDS 40pin, EDP 30pin, MIPI-CSI, NFC, RS485
- Whole board 70×110mm; -20~60℃; Android 11
- Positioning: carrier-board-free, directly mass-producible for fast landing
- application: NVR, cloud terminal, in-vehicle head unit, industrial control, edge AI
M506 · RK3506G2 · audio/HMI entry-level core board
- 3×Cortex-A7 + Cortex-M0 @1.5GHz; 128MB DDR3 SiP on-board
- Built for smart voice/audio/display output; 2D hardware engine reduces CPU overhead
- WiFi6 + BT5.0; MIPI, USB2.0 OTG, dual 100M Ethernet, 2×CAN FD, 6×UART
- half-hole 6-layer board; Buildroot / Yocto
- Applications: appliance display-control, handheld POS, building intercom, industrial control gateway, HMI
M08D · RK2108D · Audio AI stamp-hole SoM
- 16.0×16.0mm stamp-hole (LGA-castellated) core module; 60 edge pads (J1)
- Rockchip RK2108D: HiFi3 high-performance DSP + Cortex-M4F MCU
- Integrated RK962 Wi-Fi 4 (802.11 b/g/n) + BT 5.3 combo
- 2-mic / 4-mic audio algorithm capability; ultra-low power
- OS: RT-Thread; applications: AI voice, AI companion, smart screen, live mic, speaker, soundbar, small appliance
Production Module Gallery
Real modules and finished units from BesTom's past mass production, for selection and mechanical reference. Click to enlarge.
Selection Guide
| Customer scenario | Recommended | Reason |
|---|---|---|
| On-device large model / robot / smart cockpit | M88 | RK3588 6 TOPS + large memory, runs 7B/13B quantized models |
| Cost-effective edge AI (NVR / AI box) | M76 | RK3576 6 TOPS, better price than 3588 |
| Mainstream industrial gateway / HMI / self-service terminal | M68 | RK3568 balanced, full interfaces, high value |
| Small form, space-limited industrial control / POS | M66 | 45×45mm stamp hole, industrial temp range |
| Direct mass production, no carrier-board design | B66 | Finished-unit main board, POE/display interfaces complete |
| Voice / appliance display-control / low-cost HMI | M506 | RK3506 low-power audio-dedicated, SiP DDR |
| AI voice / soundbar / smart-home audio (16×16mm stamp hole, 2/4-mic) | M08D | RK2108D HiFi3 DSP + RK962 Wi-Fi4/BT5.3, ultra-low power |